Changdian technology is the world's leading integrated circuit manufacturing and technical service provider. It provides a full range of one-stop services for the manufacturing of finished chip products, including system integration, design simulation, technology development, product certification, in wafer test, wafer level medium channel packaging test, system level packaging test and finished chip test of integrated circuits, and can provide direct transportation services to semiconductor customers all over the world.


Through the highly integrated wafer level (WLP), 2.5d/3d, system level (SIP) packaging technology and high-performance flip chip and lead interconnection packaging technology, the products, services and technologies of Changdian technology cover the mainstream integrated circuit system applications, including network communication, mobile terminal, high-performance computing, vehicle electronics, big data storage, artificial intelligence and Internet of things, industrial intelligent manufacturing and other fields. Changdian technology has more than 23000 employees worldwide, six production bases and two R & D centers in China, South Korea and Singapore, and business institutions in more than 22 countries and regions, which can carry out close technical cooperation with global customers and provide efficient industrial chain support.